Rapid Thermal Processing to Enhance Steel Toughness
نویسندگان
چکیده
منابع مشابه
Thermal Model of Rapid Thermal Processing Systems
Continuously shrinking device parameters and the enlargement of wafer diameters in semiconductor industry require best temperature homogeneity in Rapid Thermal Processing (RTP). This together with the requirement of high ramp rates in the range of 200 °C s as advantageously used in ultra shallow junction processes [1] challenges temperature control in RTP technology. In order to design advanced...
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ژورنال
عنوان ژورنال: Scientific Reports
سال: 2018
ISSN: 2045-2322
DOI: 10.1038/s41598-017-18917-3